Adduci, Mastriani & Schaumberg LLP

Integrated Circuit Packages

On May 31, 2012, a new Section 337 Complaint, Certain Integrated Circuit Packages Provided With Multiple Heat-Conducting Paths and Products Containing the Same, was filed at the U.S. International Trade Commission. 

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Legend:
§ 337
Unfair practice complaint

§ 332
Request for study

§ 731
Antidumping petition

§ 701
Countervailing duty petition

§ 751
Changed circumstances petition

§ 201
Escape clause petition

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